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Power MOSFETs
2SK3731
N-channel enhancement mode MOSFET
Features
* Low on-resistance, low Qg * High avalanche resistance
(1.4)
Unit: mm
10.50.3 4.60.2 1.40.1
0.60.1
3.00.5 0 to 0.5
* For PDP * For high-speed switching
1.40.1 0.80.1 2.540.3 2.50.2
0 to 0.3
Absolute Maximum Ratings TC = 25C
1 2 3
(10.2) (8.9)
(6.4) (1.4)
Parameter Drain-source surrender voltage Gate-source surrender voltage Drain current Peak drain current Avalanche energy capability Power dissipation Ta = 25C Channel temperature Storage temperature
*
Symbol VDSS VGSS ID IDP EAS PD Tch Tstg
Rating 230 30 20 80 668 50 1.4 150 -55 to +150
Unit V V A A mJ W
(2.1)
1: Gate 2: Drain 3: Source TO-220C-G1 Package
Marking Symbol: K3731
C C
Note) *: L = 2.79 mH, IL = 20 A, VDD = 50 V, 1 pulse, Ta = 25C
Electrical Characteristics TC = 25C 3C
Parameter Drain-source surrender voltage Gate threshold voltage Drain-source cutoff current Gate-source cutoff current Drain-source ON resistance Forward transfer admittance Short-circuit forward transfer capacitance (Common-source) Short-circuit output capacitance (Common-source) Reverse transfer capacitance (Common-source) Turn-on delay time Rise time Turn-off delay time Fall time Symbol VDSS Vth IDSS IGSS RDS(on) Yfs Ciss Coss Crss td(on) Tr td(off) tf VDD 100 V, ID = 10 A RL = 10 , VGS = 10 V Conditions ID = 1 mA, VGS = 0 VDS = 10 V, ID = 1 mA VDS = 184 V, VGS = 0 VGS = 30 V, VDS = 0 VGS = 10 V, ID = 10 A VDS = 10 V, ID = 10 A VDS = 25 V, VGS = 0, f = 1 MHz 7 65 14 2 360 394 49 31 27 214 47 Min 230 2.0 4.0 10 1 82 Typ Max Unit V V A A m S pF pF pF ns ns ns ns
1.50.3
Applications
10.10.3
Publication date: March 2004
SJG00038AED
1
2SK3731
Electrical Characteristics (continued) TC = 25C 3C
Parameter Diode foward voltage Reverse recovery time Reverse recovery charge Gate charge load Gate-source charge Gate-drain charge Thermal resistance (ch-c) Thermal resistance (ch-a) Symbol VDSF trr Qrr Qg Qgs Qgd Rth(ch-c) Rth(ch-a) Conditions IDR = 20 A, VGS = 0 L = 230 H, VDD = 100 V IDR = 10 A, di/dt = 100 A/s VDD = 100 V, ID = 10 A VGS = 10 V 142 668 43 6.6 16 2.5 89.2 Min Typ Max -1.5 Unit V ns nC nC nC nC C/W C/W
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Safe operation area
1 000 Non repetitive pulse TC = 25C IDP ID 10 t = 100 s t= 1 ms t= 10 ms DC
PC Ta
100 (1) TC = Ta (2) Without heat sink
100
Collector power dissipation PC (W)
Drain current ID (A)
50 (1)
1
10-1
(2)
10-2 1 10 100 1 000
0
0
25
50
75
100
125
150
Drain-source voltage VDS (V)
Ambient temperature Ta (C)
2
SJG00038AED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
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